Service
PCB Assembly (PCBA)
Full turnkey and consignment assembly with tight process control — SMT, through-hole, and mixed technology, backed by in-line inspection at every stage.
Overview
Precision assembly from prototype to volume
Our SMT lines handle fine-pitch components and dense boards with consistent, repeatable results. Whether you need a handful of prototypes or a scheduled production run, the same quality process applies at every batch size.
- Turnkey (we source) or consignment (you supply parts)
- SMT, through-hole (THT), and mixed-technology assembly
- AOI and X-ray inspection on every production batch
- In-circuit & functional testing before shipment
Capabilities
Assembly capability at a glance
| Parameter | Capability |
|---|---|
| Component packages | 0201 to large BGA/QFN, fine-pitch down to 0.3 mm |
| Assembly type | SMT, THT, mixed technology |
| Board size range | 10 x 10 mm to 500 x 500 mm |
| Inspection | AOI (pre & post-reflow), X-ray for BGA/QFN |
| Testing | ICT, flying probe, functional test (custom fixtures on request) |
| Standard lead time | 5-10 business days after component readiness |
Quality
Inspection at every stage
Defects caught early save time and cost. Our process checks quality before, during, and after assembly.
Incoming Inspection
Components verified against BOM before they reach the line.
AOI Inspection
Automated optical inspection after placement and reflow.
X-Ray Inspection
Hidden-joint verification for BGA, QFN, and stacked packages.
Functional Test
Boards verified against your spec before packing and shipment.